2nd International Conference on Structural Adhesive Bonding - AB2013, Oporto (Portugal). 04-05 julio 2013
Resumen:
Copper foil has been used on printed circuit boards (PCB) for more than 50 years. These PCB are produced by laminating together several plies of woven glass-reinforced epoxy prepreg clad with copper foils [1]. The adhesion at the interface between copper foil and dielectric material (FR4, CEM-3) must be reliable during manufacturing, assembly and in-service use [2,3]. Mechanical, chemical and physical surface treatments have been used on copper to enhance adhesion [4]. In this study, several surface treatments have been investigated (sanding, etching, nodular electro-plating, silane, grit blasting and atmospheric plasma). Effects on the surface properties were studied by Fourier Transform Infrared Spectroscopy (FTIR), Atomic Force Microscopy (AFM), Scanning Electron Microscopy (SEM), Contact Angle (CA). Pull-off, peel and single-lap shear tests were used to evaluate the adhesion properties of the treated copper.
Fecha de publicación: julio 2013.
Cita:
Rodríguez, C., Villapún, V., Ballesteros, Y., del Real-Romero, J.C., Surface treatment of copper foil for electronic applications, 2nd International Conference on Structural Adhesive Bonding - AB2013, Oporto (Portugal). 04-05 julio 2013.
IIT-13-088A_abstract
