Copper foil has been used on printed circuit boards (PCB) for more than 50 years. These PCB are produced by laminating together several plies of woven glass-reinforced epoxy prepreg clad with copper foils . The adhesion at the interface between copper foil and dielectric material (FR4, CEM-3) must be reliable during manufacturing, assembly and in-service use [2,3]. Mechanical, chemical and physical surface treatments have been used on copper to enhance adhesion . In this study, several surface treatments have been investigated (sanding, etching, nodular electro-plating, silane, grit blasting and atmospheric plasma). Effects on the surface properties were studied by Fourier Transform Infrared Spectroscopy (FTIR), Atomic Force Microscopy (AFM), Scanning Electron Microscopy (SEM), Contact Angle (CA). Pull-off, peel and single-lap shear tests were used to evaluate the adhesion properties of the treated copper.
2nd International Conference on Structural Adhesive Bonding - AB2013, Oporto, Norte (Portugal). 04 julio 2013
Fecha de publicación: julio 2013.
C. Rodríguez, V. Villapún, Y. Ballesteros, J.C. del Real-Romero, Surface treatment of copper foil for electronic applications, 2nd International Conference on Structural Adhesive Bonding - AB2013, Oporto, Portugal, 04-05 Julio 2013.