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Mechanical, thermal and wear properties in nano-composites: effect of silica amount

J. Abenojar, J. Tutor, Y. Ballesteros, J.C. del Real-Romero, M.A. Martínez

2ª Conferência Luso-Brasileira de Adesão e Adesivos - CLBA2014, Oporto (Portugal). 24-25 Julio 2014


Resumen:
Nanoparticles, such as silica (SiO2), can increase the fracture toughness [1] of epoxy resin, other fillers as for instance cork microparticles can also decrease brittleness [2]. Furthermore, the (nano and micro) fillers for epoxy resins are object of numerous studies, related to modify the mechanical properties, wear resistance, thermal properties and the curing process of the epoxy resins. A very important application for epoxy resins is anti-cavitation painting (coating) [3]. In the light of these considerations, the objective of this work is to study the SiO2/epoxy nanocomposites (with two different percentages in silica, 3 and 5 wt.%). In particular, the study focuses on the influence the addition of silica has on the mechanical, wear and cavitation erosion properties as well as on the thermal properties and the reaction curing. To accomplish the goals, nanocomposite samples in bulk and as coating were prepared. The epoxy curing process and the influence of particle additions on the glass transition temperature (Tg) are studied by DSC (Differential Scanning Calorimetry). In addition, mechanical properties (hardness, bending and tensile strength), wear resistance (in bulk and coating) and cavitation erosion are evaluated. In general, a plasticizing effect is observed with nanosilica addition. Moreover, the resistance to erosion by cavitation, in terms of cumulative erosion and erosion rate, is higher in the nanocomposites than in pure resin.


Fecha de publicación: julio 2014.



Cita:
Abenojar, J., Tutor, J., Ballesteros, Y., del Real-Romero, J.C., Martínez, M.A., Mechanical, thermal and wear properties in nano-composites: effect of silica amount, 2ª Conferência Luso-Brasileira de Adesão e Adesivos - CLBA2014, Oporto (Portugal). 24-25 Julio 2014.

IIT-14-095_abstract

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