Temperature controlled multi-oven for MTF tests

C. Ciofi, R. Giannetti, B. Neri

15th IEEE Instrumentation and Measurement Technology Conference - IMTC 1998, Saint Paul (United States of America). 18-21 mayo 1998

Summary:
The design and principle of operation of a measurement system primarily intended for performing MTF (median time to failure) tests on metallic interconnections of integrated circuit is presented. The instrument is different from other similar equipment in that a separate heating system is used for each sample. This approach will allow one, probably for the first time, to perform such tests in the ideal conditions of constant current and temperature for all the samples.

Keywords: Temperature control, Circuit testing, Performance evaluation, Time measurement, Integrated circuit measurements, Integrated circuit testing, System testing, Integrated circuit interconnections, Instruments, Heating

DOI: 10.1109/IMTC.1998.676933

Publication date: May 1998.

Citation:
Ciofi, C., Giannetti, R., Neri, B., Temperature controlled multi-oven for MTF tests, 15th IEEE Instrumentation and Measurement Technology Conference - IMTC 1998, Saint Paul (United States of America). 18-21 May 1998.

IIT-98-088A